INERTEC LOTTECHNIK GmbH

Worldwide actively and with the native country roots

With over 1300 installed soldering systems, INERTEC is one of the leading companies in this market sector. Right from the start, the main focus was on the development and production of innovative soldering technologies. The corporate guiding principle was and still is today the company´s ability to react flexibly to the wishes and requirements of the user, and to continue to develop innovative products.

One of the outstanding features of these soldering systems is their ability to combine flexibility and throughput. The continuous further development of these systems ensures utmost quality, productivity and investment security. Our objective is to offer the customer a solution that will offer them a return on their investment as quickly as possible. If the standard systems do not always suit, we will coordinate with the customer to create bespoke solutions - from rotary indexing through to logistical links.

Our services range from consultation and planning through to supply, assembly and a reliable on-site service.

QUALITY: Thanks to controlled production processes

The satisfaction of our customers is our greatest objective. We demonstrate this with our state-of-the-art, innovative soldering machines, the quality of our products and our orientation to customer requirements. Our qualified service team installs the machines, trains your employees and helps you to introduce the process.

The spare parts supply is carried out directly from Kreuzwertheim or from the warehouses of our individual service partners. Thanks to the consistent standardization, many parts are also identical for different system types, therefore facilitating warehousing. We always aim to have spare parts sent out to customers within 24 hours, making sure they can get their system back up and running as quickly as possible.

CUBE 460

The new CUBE 460 entry-level soldering system is designed as a production cell for small and medium batch sizes. With the loading shuttle, it is possible to perform THT assembly directly on the machine, at the same time as significantly improving quality when compared to manual soldering.

The simplified graphical programming gives you a quick entry into selective soldering technology. Benefit from the professional functions and proven technology available in the larger systems, such as process monitoring or bus-capable DC servomotor.

Circuit boards or components up to 460 x 460 mm, with or without lead content, are processed with quick-change, flexible soldering nozzles. In the design, particular attention has been paid to simple setup and maintenance, through good accessibility.

The capability of setting the soldering angle to 0° and 7° with program control makes it possible to use various soldering nozzles under optimum conditions for each one. This means difficult layouts can often be achieved, with ultra-narrow clearances.

The CUBE 460 is excellently suited to using various solders when our set-up carriage is employed. Increase your throughput and flexibility by a second soldering module with program-controlled stroke.

An electro dynamic pump is available as an alternative to the standard soldering pump.

The standard microdrop fluxer achieves a precise application pattern for fluxing with very few residues.

The process observation camera helps you to optimize the process.

High-performance quartz pre-heating guarantees efficient pre-heating and low energy consumption.

CUBE 460 Software


  • INERTEC has worked on the software GUI (Graphical User Interface) specifically for simplified operation. The control system for the CUBE is based on the systems from the ELS 3.3 and EMLS product lines which have proven themselves over many years. Programming can be carried out without having to dispense with the convenience of offline software.
  • The software has been expanded to include a warpage correction module. This makes it possible to compensate for circuit board warpage by correcting the z-axis. During the programming, the circuit board warpage is visualized at every point and transferred into the program.
  • The optional Fiducial sensor is correcting the positioning during the solder process.
  • Also the RT-Console control program now impresses with additional modules. The statistical module records the circuit boards that are produced. The production figures can be called up subsequently (according to DMX code or program name).
  • A line plotter function makes it possible to log the analog measurement values (such as solder temperature, nitrogen temperature) on a 24/7 basis.
  • Barcode integration, automatically time functions, integrated maintenance reminders as well as online access are standard functions and included in the software.

CUBE 460 Machine Specifications

Dimensions with shuttle L 2000 mm; W 1550 mm; H 1250 mm (79“ x 61“ x50“)
Dimensions without shuttle L 1430 mm; W 1550 mm; H 1250 mm (57“ x 61“ x 50“)  
Weight Ca 800 kg  
Colour base frame RAL7035; door panel RAL7021  
Exhaust opening Ø150 mm (6“)
Extraction rate 400m³/h
Power requirements 3x32 A; 3x400V; 50 Hz;6KW  
System control
Control concept PC; Beckhoff PLC
Interface Ethernet, USB
USV Optional
PC PC; Flat screen monitor; keyboard; mouse
Offline software Offline software for easy programming
Axis type XY-Portal; Z-axis lift
Camera Camera with cross hair for online programming
Axis movement Combination of toothed belts and ball screw
Drive concept DC Servo motors with encoders; CAN-BUS
Repeatability ±0,15 mm (±0,006“)
Board size
Dimensions min/max 20x20 mm / 460x460 mm (0,8“x0,8“ / 18“x18)
Soldering angle
Soldering angle 0° oder 7°
Bottom side clearance 30 mm (1,2“)  
Top side clearance 150 mm (6“)  
Carrier Special fixtures available, downholder, etc.
Flux System
Fluxer type Micro Drop
Flux Alcohol based with 5% solids recommended
Flux container 3 litre pressurised pot with level indicator
Second flux pot for different flux type available
Preheat
Type Quartz Rods
Power approx. 4 KW
Top side preheat Built into the gripper
Solder Pot
Solder pot (big size) enables to add a second mini wave module Solder volume lead-free (45 Kg) / leaded (50 Kg)
Using two small solder pots enables to operate with different alloys Solder volume lead-free (21 Kg) / leaded (24 Kg)
Solder pot with a wave module = 200mm Solder volume lead-free (58 Kg) / leaded (66 Kg)
Additional mini wave module For parallel soldering or in combination with the module lifting different nozzles can be used in one programm
Additional nozzle heating High performance additional nozzle heating including temperature controller
Additional solder nozzles Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“)
Wetted (multi directional) nozzle Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“)
Warm up time Circa 45 minutes  
Solder temperature Maximum 330°C
Solder temperature control solder aggregate
Solder wave height control Programm controlled
Solder wire feeder Motor driven up to 1,5 - 2mm (other sizes on request), solder wire max 5 kg
Nitrogen inerted Nitrogen quality, 5.0 is recommended, max pressure 5,5 bar
Nitrogen consumption Depending on User soldering nozzle 1-3 m3/ hr  
Process Camera Camera „real time“ to view the soldering process
Trolley and Exchangeable solder pot Exchanging of the soldering aggregate for the use of different alloys
Electro-dynamic solder pump Alternative to a standard rotarydrive pump
 

Standard       Optional  


NEW CUBE Inline


Highest quality, flexibility and efficiency is what you get with our new Selective Soldering System CUBE Inline.

The basic construction of the CUBE Inline has the possibility to work simultaneous in the areas fluxing, preheating and soldering. Preheating is always a special challenge, especially with lead free solder and thermal challenging printed circuit boards. For this reason the CUBE Inline has as standard equipped with a quick reacting quartz heater.

High attention has been paid to the convenience and the ease of use of the programming Software. The offline programming can use Gerber files as well as jpg files. The CUBE software has functions such as auto routing and scheduled maintenance reminders that makes the production day easier.

The preheater covers the full process area of 510 x 460 mm and guarantees a constant – and via an optional Pyrometer – controlled heating of the PCB.

 

As an independent module it can be equipped with various combinations for example with a bottom / top side heater and quartz and with convection support if required. During the soldering process the optional top side heater will allow an efficient heat to assist the soldering of high thermal mass PCB´s

The wave height is measured and adjusted via a titanium needle.

 

The possibility of having two solder aggregates allow you to handle two different alloys or the possibility of operating different nozzle sizes.

The hot gas nitrogen together with the new style soldering nozzle supports the soldering process with a constant local preheat. The process camera gives a perfect view of the soldering process and is a perfect tool for the process optimization. Additionally the camera makes the programming easier and saves time as well as money.

 

Highest reliability and precision with the option of the Fiducial Correction. The optional warpage sensor measures the warpage of the PCB after the preheat and corrects the z-height automatically.

The new design enables a fast change over of the solder nozzles.

The unit can be dismounted very easily during maintenance or a product change. If products need to be soldered with other nozzle sizes only the tip of the nozzle needs to be changed.

CUBE Inline Software


  • INERTEC has worked on the software GUI (Graphical User Interface) specifically for simplified operation. The control system for the CUBE is based on the systems from the ELS 3.3 and EMLS product lines which have proven themselves over many years. Programming can be carried out without having to dispense with the convenience of offline software.
  • The software has been expanded to include a warpage correction module. This makes it possible to compensate for circuit board warpage by correcting the z-axis. During the programming, the circuit board warpage is visualized at every point and transferred into the program.
  • The optional Fiducial sensor is correcting the positioning during the solder process.
  • Also the RT-Console control program now impresses with additional modules. The statistical module records the circuit boards that are produced. The production figures can be called up subsequently (according to DMX code or program name).
  • A line plotter function makes it possible to log the analog measurement values (such as solder temperature, nitrogen temperature) on a 24/7 basis.
  • Barcode integration, automatically time functions, integrated maintenance reminders as well as online access are standard functions and included in the software.

CUBE Inline Machine Specifications

Dimensions L 3000 mm; W 1550 mm; H 1310 mm (119“ x 61“ x 52“)  
Colour Base frame RAL7035; door panel RAL7021  
Exhaust opening 3 ports - Ø 150 mm (6“)  
Power requirements Europe 3x32 A; 3x400 V; 50 Hz; 22,5 KW  
Power requirements US 3x63 A; 3x208 V; 60 Hz; 22,5 KW  
Including Top Side heat, Solder aggregate, Hot Gas Nozzle Heating  
System Control
Control concept PC; Beckhoff PLC
Interface Ethernet, USB
UPS Optional
PC PC; Flat screen monitor; keyboard; mouse
Offline Software Offline software for easy programming
Axis type XY-Portal; Z-axis lift for the soldering units
Camera Camera with cross hair for online programming
Axis movement Combination of toothed belts and ball screw
Drive concept DC Servo motors with encoders; CAN-BUS
Repeatability ±0,15 mm (±0,006“)
Board size
Dimensions min/max length x width Min. 80 x 50 mm/ max. 510 x 460 mm
Soldering angle
Bottom side clearance 20 mm standard
Top side clearance 100 mm (3,94“)
Pin chain conveyor Segmented conveyor with 3 mm edge clearance
Carrier Universal carrier or special fixtures with an integrated downholder available
Flux System
Fluxer type Micro Drop
Fluxer type Spray fluxer or SONOTEK ultrasonic type
Flux Alcohol based up to 5% solids recommended
Flux container 3 litre pressurised pot with level indicator
Flux container Second flux pot for different flux type available
Preheat
Type Quartz Rods
Top side preheat Additional heater above the standard bottom preheater or above the soldering area
Solder Pot
Solder pot Lead-free / leaded
Solder pot (lead-free) approx. 25 kg
Solder pot (leaded) approx. 30 kg
Additional mini wave module For parallel soldering
Additional nozzle heating High performance additional nozzle heating including temperature controller
Additional solder nozzles Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“)
Wetted (multi directional) nozzle Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“)
Warm up time approx. 45 minutes
Solder temperature Maximum 330°C
Solder temperature control PID controlled
Solder wave height control Program controlled via titanium pin
Solder wire feeder Motor driven up to 1,5 - 2mm (other sizes on request), solder wire max 5 kg
Nitrogen inerted Nitrogen quality, 5.0 is recommended, pressure max. 5,5 bar  
Nitrogen consumption Depending on User soldering nozzle 1-3 m3/ hr  
Process Camera Camera „real time“ to view the soldering process
Trolley For the exchange of the soldering aggregates
 

Standard       Optional  


The ELS 3.3 soldering system has been designed for the production mix of small and medium series. The easy-to program mini waves with wettable and contra flow nozzles enable any subassembly to be processed using optimized parameters.

Hundreds of INERTEC multi-axis soldering systems from the ELS series have been used since 1993 in electronics productions worldwide.

These soldering systems enable virtually all manual soldering applications to be automated. The soldering quality is on a par with that of forming gas mass soldering systems. This system, which is preferred by numerous well-known electronics service providers, offers a solid design and simple programming.

Using the soldering nozzle quick-change system, the unit can be modified with just a few hand movements to handle the most varied of soldering tasks. A precise control of the soldering heights and temperatures forms the basis for the reliable process controls required by the user.

The soldering module that is supplied with two simultaneous or autonomous soldering modules ensures the maximum technological availability for all products; large connectors or point soldering – not a problem for this system. An interchangeable soldering module and a transportation unit are also available upon request. The use of lead-free solder is obligatory and the soldering module is enamelled throughout.

The soldering module is equipped with an axis-controlled flux system and a multi-stage glass ceramic pre-heating system specially developed for subassembly production.



The ELS 3.3 soldering system is designed as a soldering centre for inline operation with a connection to external transport systems. For special applications, the soldering unit can be expanded so that the crucible can take up to 4 waves in parallel.

Thanks to the solid construction of the soldering unit and the professional X-Y-Z axes system with servo drives, high piece weights can be processed. It is therefore possible to integrate this in the alignment and hold-down functions of the gripper. Thanks to the inline design of the indivdiual components, fluxing, pre-heating and soldering, 3 pallets can be processed in the system and the processes managed separately from each other in a cycle-neutral manner. A pin chain transport is installed above the fluxer and the pre-heating system for this purpose. A 40-mm soldering wave can be used for soldering work on small subassemblies.

Take your pick from a multitude of interchangeable nozzles to suit those special soldering tasks.  We have the ideal solution for virtually all your soldering needs.

ELS 3.3 Software


The ELS 3.3 Inline is the ideal solution if you require flexibility and throughput. Its intelligent soldering modules make it unnecessary to change nozzles or you can use several soldering nozzles in parallel. It can also operate with 2 solder crucibles containing different solders simultaneously – you can even use a full wave. The ELS 3.3 therefore sets new standards in terms of flexibility and throughput.

Increased quality demands in the automotive sector call for a qualified soldering process, with the respective process controls and batch traceability – an evident advantage of this automated solution. The ELS 3.3 is perfectly prepared – with its diverse traceability concepts from simple barcode detection through to complex main computer connection.

Today, the efficiency of the software plays a significant role. How quickly can I implement my project? Well, if you have the right tools … in next to no time. Offline – generate the basic program with ease, either graphically using the workplace or by means of Gerber files. Already at this stage you can optimize process paths, calculate cycle times and launch a simulation run. You then simply adapt the process parameters on the machine´s computer to suit the circuit board – job done.


Dimensions L x W x H: 3150 x 1100 x 1800 mm

Weight: approx. 1000 kg without solder

Principle of function: Miniwave (max. 4)

Processible formats: max. LP 460 x 460 mm or WT

Fluxer: X/Y Microdrop, spray fluxer

Pre-heating: IR, top heating optional

Soldering wave: 3 - 40 mm as standard

Solder bath: 40 – 50 kg, max. 350°C, coated in high-grade steel

Nitrogen consumption: 0.2 – 6 m3/h

Nitrogen pre-heating: Up to 250°C

2 solder crucibles

Quick-change crucible

Full wave module

N2 pre-heating up to 250°C

Several mini wave modules (parallel operation or additional tools)

N2 monitoring as process control

High-performance IR bottom heating

High-performance IR top heating

Process monitoring camera in real time

Position correction (Fiducial module)

Warpage correction to prevent deflections

Barcode reader for selecting programs with process parameters

Integration of a workplace as a loading shuttle

Traceability concept available



EMLS3235 is the most powerful soldering system offered amongst our selective soldering systems. The unique solde-ring system is based on product-specific soldering requirements, applying solder to all locations simultaneously with very high quality and unmatched repeatability.

You will notice a considerable increase in productivity regardless of the number of components being soldered.  This is achieved by the use of multiple individually built nozzles. Fluxing will not become the bottleneck as this is also achieved by a tool based delivery system touching all points simultaneously depositing the precise amount of flux. This is a robust solution for the fluxing process regardless of the caustic environment. If an increased through-put is required, additional flux, pre-heat, and soldering modules can be easily added.

Moreover, the new innovative tool changeover concept in combination with a trolley makes the product change simple, safe, and quick with changeover times often less than 5 minutes.

 

The soldering process features a skimming step that takes place in a nitrogen inerted atmosphere. This guarantees a perfectly clean solder tool during the solder process. The skimming step takes place while the solder tool is completely immersed in the solder bath (when not in use) to prevent dross and contamination buildup on the tool.


Inertec supports your soldering application from the very beginning. All aspects of the service and support are project managed.

From tool design, to the soldering process, and over 20 years of soldering experience Inertec takes great care and pride in developing all types of through-hole solutions.


Clearance as low as 2mm around a solder joint.

Repeatable accured amount of solder applied to the PCB.

A dramatic reduction in solder balls.

Tooling designed to meet thermal demands of the PCB.

Stable soldering results without any draining effects of a dynamic system.

Nitrogen inert soldering environment for highest quality.

Cycle time independent from the number of solder joints.

Powations available with convection/IR or quartz heaters.

Stable and repeatable solder results guaranteed through top and bottom board clamping.


EMLS Software


  • The control system for the EMLS is based on the systems from the ELS 3.3 and CUBE product lines which have proven themselves over many years. Programming can be carried out very comfortable for great flexibility.
  • Also the RT-Console control program now impresses with additional modules. The statistical module records the circuit boards that are produced called up subsequently (according to DMX code or program name).
  • A line plotter function makes it possible to log the analog measurement values (such as solder temperature, nitrogen temperature) on a 24/7 basis.
  • Barcode integration, automatic time functions, integrated maintenance reminders as well as online access are standard functions and included in the software.

New GUI is user friendly and intuitive.

Different user levels.

Display and recording of process parameters.

Automatic time functions including time stamp for messages information as number of PCB’s produced.

Maintenance reminders.

Online access.

Barcode reader integration available.

Linking to MES is available optional.


Machine Specification EMLS 3235

Dimensions L 3100 mm (3T); 4200 (4T); B 1500 mm; H 1850 mm (122“ (3T); 165“ (4T) x 59“ x 73“)
Weight Ca 2500 kg  
Colour base frame RAL7035  
Exhaust opening 3 ports Ø200 mm (7,8“)
Extraction rate 800 - 1000 m³/h
Power requirements 3x32 A; 3x400V; 50 Hz; 30-40KW depending on the mechine version  
System Control
Control concept PC; Beckhoff PLC
Interface Ethernet, USB
USV Optional
PC PC; Flat screen monitor; keyboard; mouse
Software INERTEC HMI
Tracebility customized on the current systems  
Axis movement Combination of toothed belts and ball screw
Drive concept DC Servo motors with encoders; CAN-BUS
Repeatability ±0,15 mm (±0,006“)
Board size
Dimensions min/max 320 x 350 mm (12,6“ x 13,8“)
Bottom side clearance 20 mm (0,8“)  
Top side clearance 100 mm (3,9“)  
Pin chain conveyor Segmented conveyor with 5mm edge clearence  
Carrier Special fixtures available, downholder, etc.
Stamp Fluxer
Flux tooling with servo axis tolling with brushes fitted
Downholder Compressed air
Flux Alcohol based with max.10% solids recommended
Flux container Ca. 25 litre pot with level indicator
Option XY - Fluxer
Fluxer type Micro Drop
Flux Alcohol based with 5% solids recommended
Flux container 3 litre pressurised pot with level indicator
  Second flux pot for different flux type available
Preheat
Type Quartz Rods; infrared; covection
Solder Pot
Solder pot Solder volume: lead-free / leaded 550 - 600 Kg
Warm up time Ca 3 h  
Solder temperature Maximum 330°C  
Solder temperature control solder aggregate - PID controler  
Solder feeder max 5 kg
Nitrogen inerted Nitrogen quality, 5.0 is recommended, max pressure 5,5 bar
 

Standard       Optional