ILLINOIS TOOLS WORKS, INC.

ITW EAE is a division of the Illinois Tools Works, Inc. (NYSE: ITW), a Fortune 200 global industrial manufacturer with operations in 58 countries. ITW EAE is a developer and provider of capital equipment used in electronics manufacturing, and is found in premier printed circuit board (PCB) assembly facilities the world over. ITW EAE comprised with industry-leading brands: MPM printing equipment for electronic materials; Camalot Systems fluid dispensers; Electrovert reflow soldering, wave soldering, and curing, and cleaning equipment; Despatch industrial oven and furnaces.

ITW EAE manufacturing centers are located in Camdenton, Missouri, USA; and in Suzhou, China. Sales and support offices are located in Franklin, Massachusetts, USA; Lakeville, MN, USA; Camdenton, Missouri, USA; Guadalajara, Mexico; Singapore, Suzhou, China; Oosterhout, Netherlands; and in Frankfurt, Germany.

AUTOMATIC SOLDER PASTE PRINTER

Momentum BTB Series: (Back to Back) Printers

About Momentum BTB Series

  • Use individually (single stand-alone machine) or 2 in BTB configuration
  • Two single-lane Momentum BTB machines in Back to Back layout create a dual-lane throughput solution
  • BTB setup increases throughput, not line length
  • Front-side total accessibility allows tight BTB location for both machines
  • Each printer is 200m shorter than original Momentum platform (Elite, HiE)
  • No extra space required for accessibility between the machines
  • Momentum BTB is a cost-effective and flexible solution that helps maximize productivity with a dual lane line
  • BTB maximum stencil size is 29” x 29”



Why Momentum BTB

  • Identical single-lane printers are easily re-deployed to other lines when needed
  • Maximum PCB size 609.6 mm x 508 mm (24” x 20”) [When running in dual lane configuration]
  • Wet print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ Capability designed in and independently verified
  • Smaller footprint - BTB 1.4 meter deep (55”)
  • Overall length of 2.8m for the two machines

BENEFITS & FEATURES

Patented Single Camera Vision Alignment System


  • MPM's Patented Look-Up/Look-Down technology ensure board-to-stencil alignment is accurate and repeatable
  • No moving optical parts guarantee durability and reliability
  • Flexibility to recognize unlimited number of fiducial image patterns through enhanced vision recognition strategies

Benchmark Software


  • Window Operating System anchors Speedline's "Benchmark" software standard offering stability and ease of use
  • Software developed, tested and released from Speedline Headquarters. No third party development ensuring software integrity
  • Easy programming and on-board software wizards make programming and operation simple and efficient
  • Touch screen friendly option available


Patented Ultrawipe Stencil Cleaner


  • Patented solvent bar delivers maximum control of solvent application increasing yields
  • Paper over plenum design reduces maintenance by filtering particles through the paper
  • Provides unassisted cleaning of the bottom of the stencil for maximum uptime and increased yields
  • Improved paper routing for fast and easy change-over
  • Low noise Vacuum pump housed within the printer frame

Closed-Loop Squeegee


  • Motor Driven Squeegee System provides maximum force control
  • Patent pending "calibration compliance routine" automatically compensates for varying blade length and stiffness to ensure consistent force
  • Patent pending close loop squeegee option provides the highest level of accuracy and responsiveness


Post Print Inspection


  • Contrast based 2D pad inspection, bridge detection and under stencil inspection to increase quality and yield
  • Inspection results are quantified to the component pad level and on-board SPC makes analysis clear and precise
  • Speedline's patented texture based inspection sees paste between pads and surrounding stencil apertures to prevent defects

EnclosedFlow Print Head


  • Excellent print results for fine feature devices
  • Tremendous savings on print media compared to squeegee blades
  • Ability to address a wide range of applications and materials
  • Considerable technology advantages over current enclosed print media solutions


EdgeLoc® Snugging System


  • MPM's EdgeLoc board clamping system takes board handling to the next level
  • The EdgeLoc system uses software controlled pressure for the optimal board holding force, and automatically adjusts to match the programmed board thickness
  • This unique solution firmly holds the board without the use of top clamps; delivering optimal stencil to board gasketing which is proven to yield higher paste release efficiency and reduced need for under stencil wiping

RapidClean


  • A high speed stencil cleaning solution that improves stencil cleaning performance and reduces cycle time when using solvent
  • RapidClean’s advanced plenum combines a vacuum and solvent stroke into a single wiper stroke
  • Reduce 3 wipe strokes to 2 for a solvent, vacuum and dry cycle, which is the most effective cleaning sequence
  • When using solvent, RapidClean reduces stencil cleaning cycle times by 5 – 6 seconds over the standard wiper


Paste Height Monitor


  • Effective solution designed to prevent defects caused by inadequate paste on the stencil
  • Utilizes advanced software and sensor technology for monitoring the paste bead for volume consistency
  • When a low paste level is detected, paste can be added automatically using the dispenser or manually
  • Easy to use, robust and highly accurate

Adjustable Stencil Adapter with Pneumatic Clamping


  • A cost effective, easy to use solution for customers that need to handle different size stencils
  • X - 20" (500mm) to 25.6" (650mm)
  • Y - 20" (500mm) to 25.6" (650mm)
  • Thickness: 0.39” (10mm) to 1.25” (32mm)
  • Can accommodate tubular frame stencils, cast frames and space saver stencils
  • Simply remove the adapter to use 29" x 29" stencils
  • For smaller stencil sizes, the adapter can stay in the machine and you simply need to slide the stencil in and out when changing stencils


SPI Print Optimizer


  • Produce consistent & accurate print results
  • Reduce or eliminate operator “tweaking”
  • Prevent defects instead of just identifying them
  • Compensates for uncontrollable or difficult to control process variables

Specifications

Maximum Board Size (X x Y)

609.6 mm x 508 mm (24” x 20”) (Dedicated workholder required for boards with an X size greater than 20”

Minimum Board Size (X x Y)

50.8 mm x 50.8 mm (2” x 2”)

Board Thickness

0.2mm (0.008") to 5.0mm (0.20”)

Maximum Board Weight

4.5 kg (9.92 lbs)

Board Edge Clearance

3.0 mm (0.118")

Underside Clearance

12.7 mm (0.5") standard Configurable for 25.4 mm (1.0”)

Board Hold-Down

fixed top clamps, centernest vacuum, Optional EdgeLoc

Board Support Methods

Centernest vacuum, Magnetic pins, vacuum pins, support blocks, Optional fixtures (tool-less) or Optional Grid-Lok

Maximum Print Area (X x Y)

609.6 mm x 508 mm (24" x 20")

Snap-off Speed

Programmable

Snap-off Distance

0 - 6.35 mm (0 - 0.25")

Print Speed

.635 mm/s - 304.8 mm/s (0.025 in/s - 12.0 in/s)

Print Pressure

0lb to 50lb (0kg to 22.7kg)

Modes Available

Dry bottom clean, Wet bottom clean, Vacuum aperture clean

Wipe Stroke

Full print area

Programmable frequency

Up to 1000 boards

Number of wipe cycles per wipe

Up to 10

Wipe on 2D failure

Automatic

Vision Field-of-View (FOV)

10 mm x 8.0 mm (0.39" x 0.31")

Fiducial Types

Standard shape fiducials (see SMEMA standards), pad/aperture

Camera System

Single camera - patented look up/look down vision

Total Process Alignment Repeatability and Accuracy

±12.5 microns (±0.0005") at 6 Sigma, Cpk greater than or equal to 2.0

Wet Print Deposit Accuracy and Repeatability

± 20 microns (±0.0008") at 6 Sigma, Cpk greater than or equal to 2.0

Machine Height (excluding light tower)

1589.4 mm (62.57") at 940 mm (37.0") transport height

Machine Depth

1394 mm (54.88")

Machine Depth

1195.4 mm (47.06")

MPM-100

11 Seconds

Momentum BTB

9 Seconds

Momentum HiE BTB

7.5 Seconds

MPM MOMENTUM ELITE

The MPM Momentum Elite is the top-performer of the Momentum series, boasting the highest throughput and shortest cycle times of all. Its vision system is driven by servos for speed, and it’s configured with a highly-efficient triple track rail system featuring an input buffer a central processing section and an output buffer.

BENEFITS & FEATURES

Post Print Inspection


  • Contrast based 2D pad inspection, bridge detection and under stencil inspection to increase quality and yield
  • RapidViewTM Inspection with faster motion design delivers high speed inspection maximizing throughput. Process time to 100% inspect a typical cell phone board drops from 71 seconds to 21 seconds (70% improvement)
  • Inspection results are quantified to the component pad level and on-board SPC makes analysis clear and precise
  • Speedline's patented texture based inspection sees paste between pads and surrounding stencil apertures to prevent defects

Automatic Support Pin Placement System


  • System automatically places support pins in a software programmable pattern simplifying both initial setup and product changeover
  • 48 tooling pin carousel located in the front of the worknest for easy access
  • Tooling pins are returned to the carousel during product changeover providing more time for the operators to work on other operations
  • Eliminates the need for custom workholders and manually placed pins used with double sided assemblies eliminating excessive costs


Camalot Inside - Integrated Dispensing Option


  • MPM's flexible solution for basic level dispensing for solder paste and glue addition after stencil printing
  • Integrates Camalot's patented and time-tested technology into MPM's Award winning platform
  • Unique capability for dispensing either 2 different material types or a two value solutions for similar material but different needle sizes, giving a wide capability for dot size range
  • Height sensing is accomplished with Laser technology and the correction is made with the machine Z axis


Specifications

Maximum Board Size (X x Y)

609.6 mm x 508 mm (24" x 20")
Staging (Momentum Elite) 457 mm x 508 mm (18" x 20")

Minimum Board Size (X xY)

50.8 mm x 50.8 mm (2" x 2")

Board Thickness

0.2 mm to 3.8 mm (0.008" to 0.15")
0.8 mm to 5.0 mm (0.031" to 0.20")
up to 6.0 mm (0.236") without top clamp foils

Maximum Board Weight

4.5 kg (10 lbs)

Board Edge Clearance

3.0 mm (0.118")

Underside Clearance

12.7 mm (0.5") standard *configurable for 25.4 mm (1.0")

Conveyor Length

1156 mm (45.5")

Board Hold Down

fixed top clamps, centernest vacuum

Board Support Methods

Magnetic pins and blocks

Locations of stencil images

Center, Front Justified and Rear Justified

Frame Size

29"x 29" (737x737mm) tubular (adapters available for smaller sizes)

Maximum Print Area (X x Y)

609.6 mm x 508 mm (24" x 20")

Snap-off Speed

Programmable

Snap-off Distance

0 - 6.35 mm (0 - 0.25")

Print Speed

305 mm/s (12.0 ips)

Print Pressure

0lb to 44lb (0kg to 20kg)

Modes available

Dry bottom clean, Wet bottom clean, Vacuum aperture clean

Wipe Stroke

Full print area

Programmable frequency

Up to 1000 boards

Number of wipe cycles per wipe

Up to 10

Wipe on 2D failure

Automatic

Vision Field-Of-View

10.6 mm x 8.0 mm (0.417" x 0.315")

Fiducial Types

Standard shape fiducials (see SMEMA standards), pad/aperture

Camera System

Single camera - patented look up/look down vision

Total Process Alignment Repeatability and Accuracy

±12.5 microns (±0.0005") at 6 Sigma, Cpk greater than or equal to 2.0

Wet Print Deposit Accuracy and Repeatability

± 20 microns (±0.0008") at 6 Sigma, Cpk greater than or equal to 2.0

Cycle Time

Momentum Elite: 6 seconds

Machine Height (excluding light tower)

1638.4 mm (64.5") at 940 mm (37.0") transport height

Machine Depth

1593.1 mm (62.72")

Machine Width (Momentum HiE)

1202.7 mm (47.35")

Machine Width (Momentum Elite)

1675.5 mm (65.96")

Electrovert VectraESTM Wave Soldering System (VES3)

Electrovert's VectraES is the ideal solution for low-to-medium volume lead-free production environments. The VectraES provides innovative subsystem technologies, an advanced control system and exceptional system wide accessibility at an economical price making it a true value leader.

BENEFITS & FEATURES

Advanced Process Capability


  • UltraFill with FloLift technology is the ideal nozzle for today’s lead-free process, promoting positive hole fill, decreasing the potential for bridging, and reducing dross generation
  • The VectraES is available with boundary type, short, and long tunnel N2 soldering technologies which sets the standard in the industry for soldering process flexibility and versatility

System Accessibility


  • Independent lift up hoods and removable front doors provide complete access to front of machine for ease of maintenance


Preheat Technology


  • Up to 6 feet of Bottom Preheat maximizes throughput and are available in either calrod or low mass forced convection type
  • Preheaters are easily accessible from front of machine
  • Closed Loop PID Control provides tight temperature control
  • Up to 4 feet Top Side Pre-heat are available in either calrod or low mass forced convection type preheat for flexibility and greater process band width
  • Both IR and Forced convection preheat are compatible with Full and Short tunnel features (any location or position)

Recipe Driven Solder Pot Height Adjustment (Lead Clearance)


  • Provides quicker, repeatable, and accurate recipe change over
  • Nozzle automatically returns to set position after maintenance for repeatable set up


FLUXER TECHNOLOGY

Optional Servospray Spray Fluxing System

  • Servo controlled reciprocating spray fluxing system
  • General purpose air atomized spray head provides consistent hole penetration
  • Pressure tank flux supply system sprays emulsion fluxes - standard feature
  • Spray uniformity achieved via programmable control
  • Ability to spray in one or both directions of travel for maximum deposition
  • Process settings fully integrated into machine program
  • Automatic self clean feature eliminates clogging and reduces maintenance


High Performance Servojet Spray Fluxing System

  • High performance servo controlled reciprocating spray fluxer
  • High velocity jetted flux droplets with concentric air atomization provides superior hole penetration
  • OA ServoJet is our most popular fluxer, is more compatiableaccross a broader range of fluxes and meets majority of ServoJet flux applications. Utilizes a single on/off valve to control flux through 8 jetted flux nozzles. The optional selective fluxing feature provides a second on/off valve; each valve controlling flux through 4 jetted flux nozzles. The optional selective fluxing feature is software controlled
  • Non-OA ServoJet utilizes 2 high speed valves allowing the ability to adjust flux depostion within the same selective flux program (valve factor). Precision selective fluxing is standard. Aggressive type fluxes may decrease the life of the valve and increase maintenance requirements
  • Advanced Graphics provides ease in programming


Servosonic Ultrasonic Spray Fluxing System


  • Ultrasonic spray head with horn design
  • Ability to spray in one or both directions of travel for maximum deposition
  • A quick release deflector is easily removable for maintenance purposes. The quick release has a fixed, one position turn in location ensuring the jet is always 90° to the pcb
  • The deflector is made of Ryton and is more corrosion resistant than titanium


WAVE TECHNOLOGY

Ultrafill With Flolift Technology

  • Patented Technology
  • Designed for Lead-Free Soldering
  • Easily changeable between N2 and Air Process requiring no extra parts (With N2 Process Option)
  • Increased Contact Time for optimum top side hole fill
  • Minimal distance between chip and main wave to optimize top side hole fill


Nitrogen Tunnel Technologies

  • The VectraES is available with Full or Short tunnel features
  • Both tunnel technologies are compatible with UltraFill nozzles and both are field upgradeable
  • The Short tunnel inerts the entire solder pot area
  • The Full tunnel with N2 injection technology inerts the entire solder pot area and injects N2 into the Full tunnel for preheaters (upper and lower) in the #1 and #2 positions
  • IR and Forced Convection preheat are compatible in any position and location (top and bottom)
  • An O2 analyzer is optional


Rotary Chip


  • Patented Technology
  • Rotating Auger Design pushes the solder to provide maximum wetting of components
  • Non-clogging Design virtually eliminates skips or misses and reduces maintenance
  • Easily changeable between N2 and Air Process requiring no extra parts


Specifications

FEATURES VectraES (VES3)
Process Alloy Type Lead Free (Qualified and Optimized) S
Process Width
Maximum PCB Width S
18” (457 mm)
Physical Characteristics Machine Length
Length of machine with rail guides (Load/Unload) S
O
136.0” (3.45 m)
157.9” (4.01 m)
Conveyor Maximum Load Weight 50 lb (22 kg)
Motorized Width O
Preheat Preheat Type
IR Calrod
Low Mass Forced Convection
IR Platen and IsoThermal Forced Convection
Fast Response IR
S
O
NA
RFQ
Preheat Length
Bottom S
O
Top O
S
(Qty. 2) at 4’ (1.2 m)
(Qty. 3) at 6’ (1.8 m)
(Qty. 2) at 4’ (1.2 m)
Solder Soldering Environment
Length of machine with rail guides (Load/Unload) S
O
Air
Main Wave UltraFill Air O
Dual/Wide Wave
Chip Wave
DwellMax Plus and DwellMax Ultra
O
NA
Nozzle Material
Melonite Coated, Stainless Steel
Titanium
S
O
N2 Soldering
Short Tunnel (Inerts entire solder pot area)
Full Tunnel (Inerts entire solder pot area and injects N2 into preheat areas for position 1 and 2) (No restrictions on preheat type and location)
O
Wave
Wave Height S
O
ExactaWave (Automatic wave height control)
12.7 mm
RFQ
O
Casting Lifetime Warranty on Solder Pot Casting O
HMP High Melting Point Capability (Special Warranty Applies) RFQ
Fluxer Fluxer Types and Options
FF
ServoSpray
ServoJet
OA ServoJet
ServoSonic
Flux Spray Start/Delay (ServoSpray/ServoSonic)
Selective Fluxing (includes flux spray start/delay) OA Servojet
High speed Servojet
Dual Flux Tank / Single Flux Head
Dual Flux Head / Dual Flux Tank
Teflon Coated Flux Tank
S
O
O
O
O
S
O
S
O
O
O
1Codes and Operating System Software and Controls
Windows 7 PC Based Software
Ethernet Based I/O
S
S
UL UL Certified and Listed for Factory Automation Equipment S
CE CE Certification O
Training Types of Training Process, Maintenance, Troubleshooting, and/or Customized Camdenton, MO USA or at Customer Site
Country of Origin Made in USA Factory based R&D, Software Engineering, and Applications Support Camdenton, MO USA