Heller Industries

Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy advanced applications requirements. By embracing challenge and change, Heller has earned the position of world leader in Thermal Process Solutions. Heller is the market leader in reflow oven technology, fluxless reflow technology, and curing oven technology, supplies solutions for electronics manufacturers and semiconductor advanced packagers worldwide.

Its advanced manufacturing and production systems supply both standard and special ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise for over 60 years. With the Largest Engineering Team in the industry, HELLER has the capability to quickly deliver special thermal processing solutions and provide your businesses with a competitive advantage!

Next Generation Reflow Oven - MK7

(Integrated with Industry-Leading Thermal Technology)

The new MK7 reflow oven is a platform that revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to see across the production floor.


Convection Reflow Ovens

Key Features:

  • Highest Yield!
  • Lowest Delta T on the board
  • Lowest Nitrogen & Electrical Usage!
  • Maintenance Free!
  • VOID Free – with Vacuum option
  • Industry 4.0 Compatibility Reflow Oven
  • Integrated Cpk software at No Charge!

Available Models:

  • 1505MK7 Reflow Oven
  • 1707MK7 Reflow Oven
  • 1809MK7 Reflow Oven
  • 1810MK7 Reflow Oven
  • 1826MK7 Reflow Oven
  • 1913MK7 Reflow Oven
  • 1936MK7 Reflow Oven
  • 2043MK7(3C) Reflow Oven
  • 2043MK7(4C) Reflow Oven

Key Benefits:

1. Superior Thermal Performance for Heating and Cooling

The MK7 platform offers superior thermal performance for both heating and cooling processes, revolutionizing the reflow industry with groundbreaking designs.

New Heating System

Enhanced low height heater module and large impeller provides the lowest delta T’s on product with improved air flow and uniformity!

New Cooling System

A variety of module types and systems are available, tailored to the application including the most demanding lead-free profile requirements. A super cooling system option is available for high mass applications that can provide cooling rates >6°C/sec and exit temperatures below 50°C.

2. Consistent Thermal Profiles & Low Delta T’s with Low Energy Consumption

Excellent thermal performance is achieved with improved designs for heating and dynamic control, while energy usage is reduced with improved sealing and insulation. The Energy Management System on MK7 ovens provides smart control when off-loading of production to further save energy consumption.

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Energy Management System on MK7 ovens provides smart control when the production line is idle to further save energy consumption.

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3. New Designs Minimize Preventive Maintenance Effort & Time

Due to the new heat exchanger design with chilled water, the water box flux management system gives superb flux filtration performance while keeping maintenance and cleaning easy during PM. The enlarged capacity of provides longer interval between PM than other flux management systems.


In close cooperation with our advanced materials provider, HELLER’s new low temperature catalyst can help remove flux during reflow resulting in a clean process chamber.

Pit-Stop features are an innovative way to reduce PM times by reducing overall oven downtimes. Parts involved with Pit-Stop features can be removed and exchanged without cooling down the oven, so production can be resumed right after the exchange.

The quick release cooling grill with anti-flux dripping design simplify flux cleanup in the cool zones, further reducing overall PM effort.

4. Energy-Efficient Designs for Low Carbon Footprint

Heller takes low-carbon, green and sustainable development as the company's long-term goals, while meeting the technical requirements of customers, and spares no effort to apply green environmental protection technology to products, helping enterprises and the world to achieve carbon peaking goals.

Energy-Efficient Designs for Low Carbon Footprint
5. Smart System for Smart Manufacturing

Digitalization is changing all areas of our lives, and manufacturing is no different. Manufacturing companies must move with this trend by adopting smart manufacturing processes in order to stay competitive. While the ultimate goals of fast delivery, low cost and high quality have remained unchanged, the management and analysis of data from production, process and equipment is now essential. HELLER understands this, and our software tools fully support smart manufacturing and Industry 4.0 .

Smart System for Smart Manufacturing

HELLER ovens are smarter ever than before with integrated HW & SW. This enables operators to monitor the process in real-time to quickly improve product quality and yield, while reducing costs. HELLER 365 provides live oven monitoring of the thermal process on board level to ensure they are under control and within specification. All data is saved which allows users to look back at previous production and process data.

Smart System for Smart Manufacturing
6. Configurable Designs for Your Application

Electronics Manufacturers demand a high level of productivity—providers are pushed to offer better results while maintaining profitability. To grow your business, you need a flexible system that can accommodate products and applications for SMT and Semicon. The MK7 is capable to serve a wide range of products and applications, giving you a competitive advantage to expand into new lines of business.


Configurable Designs for Your Application


1505MK7

1707MK7

1809MK7

1810MK7

1826MK7

1913MK7

1936MK7

2043MK7(3C)

2043MK7(4C)

Basic Data

Length (mm)(Air/N2)

2,000/2,500

3,600

4,650

4,650

4,650

5,900

5,900

6,774

7,224

Width (mm)

1,520

1,520

1,520

1,520

1,520

1,520

1,520

1,520

1,520

Height (mm)

1,440

1,440

1,440

1,440

1,440

1,440

1,440

1,440

1,440

Weight (kg)

1,510

1,550

2,060

2,060

2,060

2,520

2,420

3,765

3,765

Power and N2

Power Inputs

208/240/380/400/415/440/480 VAC

Max Current Draw

100Amp

130Amp @ 208/240V

100Amp @ 380/400/415/440/480V

Continuous Power kW

6 - 8

7 - 12

7.5 - 16

7.5 - 16

8 - 14

9 -15

9 -15

13 - 20

13 - 20

N2 Supply Pressure (bar)

5 -7

N2 Operating Pressure (bar)

6

Typical N2 Consumption**

500-700SCFH

Heating and Cooling

Heating Zones

5

7

9

10

8

13

10

13

13

Heating Length (mm) (Air/N2)

1,340/1,300

1,920

2,580

2,830

2,710

3,570

3,600

4,390

4,490

Cooling Zones*

1

1

2

2

2

3

3

3

4

Cooling Length (mm) (Air/N2)

430/410

620

1,000

750

870

1,260

1,230

1,310

1,660

Max.Temp (°C) *

350

350

350

350

350

350

350

350

350

Accuracy of Temp. Controller(°C)

+/-0.1

Profile Change Time (min)

5 - 15

PCB Support

Single Lane / MeshBelt*

50 - 560 , Option 50 - 610

Dual Lane in Single Lane Mode*

50 - 400, Option 50 - 450

Dual Lane in Dual Lane Mode*

50 - 225, Option 50 - 250

Dual Lane Rails*

FMMM, FMMF, FMFM

PCB Direction

L to R, R to L

PCB Top/Bottom Clearance (mm)*

Mesh belt: +58 Chain: +29/-29 & +35 /-35

Transportation Height (mm)*

Mesh belt: 930+/-60

Chain: 960+/-60, Option 900+/-60

Conveyor Speed (mm/min)*

250 - 1,880

Length of PCB Support Pins (mm)*

4.75

Auto Lubrication System

S

Power Width Adjustment

S

KIC Profiling Software

S


*Other Special Option is possible
** Varies with PPM, PCB size and oven configuration
S: Standard


Heller Vacuum Reflow Oven

(Low Void Soldering At High Throughput)

Vacuum Reflow Ovens

Heller Industries offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for all volumes of production from R&D to HVM.

Drivers for High Reliability Production

Rapidly growing markets such as Automotive Electronics, LEDs, and Power Electronics are seeing a higher demand for device performance with increasing reliability standards. Manufacturers now need to solder void-free in order to meet these reliability standards.


Drivers for High Reliability Production

Vacuum reflow soldering remains one of the best approaches for reducing solder void rates.

Factors that Affect Voids and Void Types

There are various types of voids which can form in SMT solder joints, such as macro voids, shrinkage voids, IMC voids and design-induced voids. Of these, macro voids (also called process voids) are most commonly seen, and can be caused by issues related to solder paste, PCB and component, or SMT processes.


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Principle for Void Removal by Vacuum

Flux or moisture can outgas during solder reflow creating a bubble or void in a soldering joint. Vacuum assisted reflow can remove these voids by applying vacuum to a solder joint during the reflow process.


standard reflow
  • Gas bubbles in liquid solder increase in size as pressure is reduced.
  • Bubbles combine with other bubbles, increasing in size until they ultimately collide with the edge of the liquid solder and escape.
  • As bubbles get larger they become more buoyant, making them more likely to escape.
Good to Know Facts

The HELLER Vacuum Reflow Oven utilizes a vacuum chamber placed in the oven's reflow zone, which provides a controlled pump down (up to 5 separate steps with closed-loop pump control) resulting in significant reductions to void rate (>1% for many applications) with zero solders platter. The horizontal, in-line architecture makes it suitable for automated high throughput production.


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facts
Key Factors for Vacuum Reflowing
1 .Sealing
2. Heating Capability

keyfacts
HELLER vacuum ovens have the hardware capabilities to ensure the highest process quality.

1. Sealing Performance
High Sealing Performance of HELLER Vacuum Chamber

A. High Sealing Performance

Advanced mechanical designs with materials suitable for high temps ensures the best sealing performance when vacuum is activated.

B. Single-Piece Machined Aluminum Chamber

CNC machined one-piece vacuum chamber with gas cooling system, ensures sealing performance and structure integrity


Design of vacuum chamber

Vacuum assisted reflow uses a vacuum chamber in the reflow process to remove voids from melted solder paste. The result is a solder joint that is void-free.


2. Heating Capability in Vacuum Chamber
Shorter Time Above Liquidus with IR Chamber Heating

A. Heating Capability in Chamber
  • IR heated vacuum chamber up to 450°C, allows for peak temperature to occur inside the chamber for shorter time above liquids.
  • Maintains or increases product temperature during the vacuum phase.
  • Balanced temperature across products of all sizes.
B. Easy Maintenance
  • Active heating inside the Vacuum Chamber prevents flux residue buildup on sidewalls and the EHC & CBS mechanisms.
  • Eliminates Conveyor Cleaning, reducing PM effort.

HELLER vacuum IR heaters enable temps as high as 450°C, and allow peak inside vacuum chamber

3-zone IR panel inside vacuum chamber

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3. Vacuum Capability and Vacuum Control
Closed Loop Pressure Control Prevents Splatter and Solder Balls

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4. Transportation Control

HELLER offers an ultra-smooth transportation system to ensure extremely low board vibrations during transport minimizing the risk of defects related to shifting parts.


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Multi-Stage Conveyor System for High UPH

HELLER's new high-UPH multi-stage conveyor system dramatically increases throughput by utilizing 5 independently controlled conveyor systems. The oven's staging conveyors move boards quickly into and out of the vacuum chamber, reducing cycle times buy up to 50%. For typically use cases, throughput improvements of 85% or more can be seen. Additionally, the system has a separate cooling conveyor which can be slowed down to increase cooling time leading to much lower board exit temperatures.


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Board Aligner for High Utilization

Productivity can be further improved by using a dual lane vacuum system with HELLER's dual lane board aligner. The board aligner accepts and holds upstream boards until both boards are aligned before allowing them to enter the oven at the same time, optimizing utilization of the vacuum chamber. Say goodbye to productivity setbacks caused by misalignment, and experience seamless board movement every step of the way.


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Vacuum Oven Specification
1808MK5-VR 1911MK5-VR 1912MK5-VR 1936MK5-VR 2043MK5-VR 2156MK5-VR
Basic Data
Length (mm) 4,650 5,900 5,900 5,890 6,780 8,690
Width (mm) 1,520 1,520 1,520 1,520 1,520 1,700
Height (mm) 1,600 1,600 1,600 1,600 1,600 1,600
Weight (kg) 3,240 3,600 3,600 2,900 4,330 5,300
Power and N2
Power Inputs 208/240/380/400/415/440/480 VAC (50HZ/60HZ)
Max Current Draw 130Amp @ 208V ~ 240V***
100Amp @ 380V ~ 480V***
200Amp @ 208V ~ 240V***
130Amp @ 380V ~ 480V***
Continuous Power kW 7-14 10-16 10-16 9-15 13-20 15-28
Power Inputs 208/240/380/400/415/440/480 VAC (50HZ/60HZ)
Nitrogen Supply Pressure (bar) 5-7
Nitrogen Operating Pressure (bar) 6
Typical Nitrogen Consumption** 500-700SCFH
Vacuum Pump (need to check detail layout for vacuum oven)
Length x Width x Height (mm) 1752 x 767 x 695
Weight (kg) 330
Power Inputs 208V ~ 480V (50HZ/60HZ)***
Max Current Draw 20Amp
Continuous Power kW 4-7
Vacuum Pump Nomiral Speed M 3/hr 280(50HZ) / 340(60HZ)
Vacuum Pressure/Speed Control 5-step Pressure / Speed Control
Heating and Cooling
Heating Zones* 7 10 11 8 10 15
Heating Length (mm)* 1,930 2,870 3,090 2,860 3,590 5,170
Cooling Zones* 2 3 3 3 3 4
Cooling Length (mm) (Air/N2)* 830 1110 1070 1,290 1,270 1,520
Max.Temp (°C) 350/450
Accuracy of Temp. Control (°C) +/-0.1
Profile Change Time (min) 5-15
Vacuum Chamber
STD Chamber Size(L x W, mm) 500x450 500x450 350x450 350x450 500x450 600-600
Option Chamber Size(L x W, mm)* / 600-600 500x450
Vacuum Chamber Heating 3-Zone IR
Vacuum Chamber Heating Power (kW) 9.5 9.5 7 7 9.5 13.5
Vacuum Chamber Max. Setting Temp.(°C)* 400, option 480
Vacuum Chamber Pressure 10 Torr(13.3mbar), Option 5 Torr(6.65mbar)
PCB Support
Single Lane / MeshBelt* 100-450 100-450 100-450 100-450 100-450 100-600
Dual Lane in Single Lane Mode* 100-240 100-240 100-240 100-240 100-240 100-400
Dual Lane in Dual Lane Mode* 100-170 100-170 100-170 100-170 100-170 100-250
>Min. Board Length* 150, option 120
Dual Lane Rails* FMMF, FMFM
PCB Direction LtoR, RtoL
PCB Clearance (mm)* Meshbelt: Top 58, Option Top 38 Chain: Top 29/Bot 29, Option Top 35 /Bot 35 Chain with CBS: Top 29/Bot 10
Transportation Height (mm)* Meshbelt: 930+/-60 Chain: 960+/-60(Chain), Option 900+/-60 Conveyor Speed (mm/min)* 250-1,880
Length of PCB Support Pins (mm)* 4.75
Auto Lubrication System S
Power Width Adjustment S
KIC Profiling Software S
Vacuum Chamber Pressure 10 Torr(13.3mbar), Option 5 Torr(6.65mbar)
*Other Special Option is possbile
** Varies with PPM, PCB size and oven configuration
***Voltage: 208V/240V/380V/400V/415V/440V/480V
high temp. with side chain (MB or Rod) or Multi-Stage Conveyor system
S: Standard


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